An earphone with stand-alone high-frequency driver includes a casing, a low-frequency driver, a high-frequency driver, and a protecting cover. The casing defines a sound-guiding passage and a separating wall. The separating wall is formed on a side surface of the sound-guiding passage and defines a sound port, which is in communication with the sound-guiding passage. The high-frequency driver is disposed next to the separating wall and defines a sound-outputting direction. The protecting cover is mated to the casing and covers the high-frequency driver. The sound waves generated by both low- and high-frequency drivers are delivered externally through the sound-guiding passage. The earphone allows structural modifications and assembling the high-frequency driver and the protecting cover after a half-finished product (casing and low-frequency driver) is obtained. Hence, no major modification of the manufacturing processes is necessary, thus shortening the manufacturing time, lowering the manufacturing costs, and avoiding delay in product delivery.