发明授权
- 专利标题: Ultrasound assisted immersion cooling
- 专利标题(中): 超声辅助浸入式冷却
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申请号: US14668331申请日: 2015-03-25
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公开(公告)号: US09516792B2公开(公告)日: 2016-12-06
- 发明人: Shankar Krishnan , Richard C. Stamey , Brian S. Jarrett , Geoffrey G. Von Allmen
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; G06F1/20
摘要:
Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.
公开/授权文献
- US20160286694A1 ULTRASOUND ASSISTED IMMERSION COOLING 公开/授权日:2016-09-29
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