Invention Grant
- Patent Title: Flexible interconnect structure for a sensor assembly
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Application No.: US14989332Application Date: 2016-01-06
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Publication No.: US09518887B2Publication Date: 2016-12-13
- Inventor: Louis DeRosa , Robert Gardner
- Applicant: KULITE SEMICONDUCTOR PRODUCTS, INC.
- Applicant Address: US NJ Leonia
- Assignee: Kulite Semiconductor Products, Inc.
- Current Assignee: Kulite Semiconductor Products, Inc.
- Current Assignee Address: US NJ Leonia
- Agency: Troutman Sanders LLP
- Agent James E. Schutz; Mark Lehi Jones
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; G01L19/14 ; H05K1/02 ; G01L15/00 ; H05K7/00 ; H05K1/11 ; H05K1/03

Abstract:
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.
Public/Granted literature
- US20160116358A1 FLEXIBLE INTERCONNECT STRUCTURE FOR A SENSOR ASSEMBLY Public/Granted day:2016-04-28
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