Invention Grant
- Patent Title: Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon
- Patent Title (中): 多层陶瓷电容器及其制造方法以及其上安装的板
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Application No.: US14099650Application Date: 2013-12-06
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Publication No.: US09520234B2Publication Date: 2016-12-13
- Inventor: Sim Chung Kang , Seung Hee Yoo , Jun Hyeong Kim , Eun Joo Choi , Kyu Ha Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0109700 20130912
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/12 ; H05K3/34

Abstract:
A multilayer ceramic capacitor and manufacturing method therefor, in which the capacitor includes a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.
Public/Granted literature
- US20150068794A1 MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME THEREON Public/Granted day:2015-03-12
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