Invention Grant
- Patent Title: Packaging substrate and package structure
- Patent Title (中): 包装基材和包装结构
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Application No.: US14564145Application Date: 2014-12-09
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Publication No.: US09520351B2Publication Date: 2016-12-13
- Inventor: Chang-Fu Lin , Chin-Tsai Yao , Ming-Chin Chuang , Ko-Cheng Liu , Fu-Tang Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103117461A 20140519
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H05K1/02 ; H01L23/31
Abstract:
A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in thickness; and a plurality of circuit layers alternately stacked with the dielectric layers. Therefore, the package warpage encountered in the prior art is avoided.
Public/Granted literature
- US20150332998A1 PACKAGING SUBSTRATE AND PACKAGE STRUCTURE Public/Granted day:2015-11-19
Information query
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