发明授权
- 专利标题: Semiconductor devices capable of self-curing
- 专利标题(中): 能自愈的半导体器件
-
申请号: US14197588申请日: 2014-03-05
-
公开(公告)号: US09520401B2公开(公告)日: 2016-12-13
- 发明人: Sungsam Lee
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-Si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2013-0058470 20130523
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L27/108 ; H01L27/02
摘要:
A semiconductor device includes a plurality of first signal lines crossing a plurality of second signal lines. At least one of the first signal lines has a first end to receive a first voltage and a second end to receive a second voltage. The first and second voltages are applied simultaneously to respective ones of the first and second ends. A difference between the first and second voltages causes joule heating in the at least one first signal line. The joule heating may correct one or more defects in the semiconductor device.
公开/授权文献
- US20140346580A1 SEMICONDUCTOR DEVICES CAPABLE OF SELF-CURING 公开/授权日:2014-11-27
信息查询
IPC分类: