Invention Grant
- Patent Title: Optoelectronic component and method for the production thereof
- Patent Title (中): 光电元件及其制造方法
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Application No.: US14784879Application Date: 2014-04-04
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Publication No.: US09520539B2Publication Date: 2016-12-13
- Inventor: Martin Brandl , Michael Zitzlsperger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102013206963 20130417
- International Application: PCT/EP2014/056809 WO 20140404
- International Announcement: WO2014/170141 WO 20141023
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H01L33/62 ; H01L33/56
Abstract:
An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.
Public/Granted literature
- US20160064618A1 OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF Public/Granted day:2016-03-03
Information query
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