Invention Grant
- Patent Title: Connection board, optoelectronic component arrangement and illumination device
- Patent Title (中): 连接板，光电元件布置和照明装置
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Application No.: US14363823Application Date: 2012-12-14
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Publication No.: US09521747B2Publication Date: 2016-12-13
- Inventor: Michael Rasp , Konrad Wagner
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102011056890 20111222
- International Application: PCT/EP2012/075614 WO 20121214
- International Announcement: WO2013/092435 WO 20130627
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/05 ; F21V19/00 ; H05K1/11 ; H05K3/00 ; F21Y101/00
Abstract:
A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out.
Public/Granted literature
- US20140345918A1 CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINATION DEVICE Public/Granted day:2014-11-27
Information query
