发明授权
- 专利标题: Heat dissipation apparatus
- 专利标题(中): 散热装置
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申请号: US14500342申请日: 2014-09-29
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公开(公告)号: US09521779B2公开(公告)日: 2016-12-13
- 发明人: Hsien-Huan Chiu
- 申请人: HON HAI PRECISION INDUSTRY CO., LTD.
- 申请人地址: TW New Taipei
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW New Taipei
- 代理商 Zhigang Ma
- 优先权: TW103110067A 20140318
- 主分类号: H01T23/00
- IPC分类号: H01T23/00 ; H05F3/00 ; H05K7/20 ; G06F1/20
摘要:
A heat dissipation apparatus includes an insulating plate, a conductive plate located on the insulating plate and a power source with an anode connected with the insulating plate and a cathode connected with the conductive plate. A conductive element is received in the insulating plate and is connected to the anode of the power source. When the heat dissipation apparatus is activated, the conductive element ionizes air closing to the insulating plate to produce positive ions. The conductive plate attracts the positive ions to move fast towards the conductive plate, which cause the air to flow in a direction in which the positive ions move.
公开/授权文献
- US20150271951A1 HEAT DISSIPATION APPARATUS 公开/授权日:2015-09-24
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