Invention Grant
- Patent Title: Connecting expansion slots
- Patent Title (中): 连接扩展槽
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Application No.: US14233970Application Date: 2011-08-18
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Publication No.: US09524262B2Publication Date: 2016-12-20
- Inventor: Chin-Yu Wang
- Applicant: Chin-Yu Wang
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2011/048286 WO 20110818
- International Announcement: WO2013/025221 WO 20130221
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F13/40 ; G06F13/38 ; G06F1/18

Abstract:
Example embodiments disclosed herein relate to selectively connecting an interconnect bus to an expansion slot. A first chip is connected to a first interconnect bus. A second chip is connected to a second interconnect bus. A switch selectively connects the first interconnect bus to one of a plurality of expansion slots.
Public/Granted literature
- US20140223064A1 CONNECTING EXPANSION SLOTS Public/Granted day:2014-08-07
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