Invention Grant
- Patent Title: Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor
- Patent Title (中): 固体电解电容器及改进的固体电解电容器制造方法
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Application No.: US14595502Application Date: 2015-01-13
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Publication No.: US09524829B2Publication Date: 2016-12-20
- Inventor: Hong Zhang , Qingping Chen , Randolph S. Hahn
- Applicant: Kemet Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Perkins Law Firm, LLC
- Agent Joseph T. Guy
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/012 ; H01G9/15 ; H01G9/028

Abstract:
An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50° C. no more than 200° C. at a relative humidity of at least 25% up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
Public/Granted literature
- US20150124374A1 Solid Electrolytic Capacitor and Improved Method for Manufacturing a Solid Electrolytic Capacitor Public/Granted day:2015-05-07
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