发明授权
- 专利标题： Printed circuit board and method for manufacturing the same
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US14849122申请日： 2015-09-09
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公开(公告)号： US09526169B2公开(公告)日： 2016-12-20
- 发明人: Hyung Gi Ha , Jae Won Jung , Yong Hwan Kim , Jong Jin Lee , Ja Ho Koo , Young Hwan Shin , Dong Kyu Lee
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2010-0138241 20101229
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K1/11 ; H05K1/02 ; H05K3/38 ; H05K3/46
摘要：
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a granular structure formed on the first surface roughness.
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