Invention Grant
- Patent Title: Cold chassis for electronic modules and method of making same
- Patent Title (中): 用于电子模块的冷底盘及其制造方法
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Application No.: US14492818Application Date: 2014-09-22
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Publication No.: US09526192B2Publication Date: 2016-12-20
- Inventor: David H. Altman , Scott R. Cheyne , Anurag Gupta
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: F28F3/02
- IPC: F28F3/02 ; H05K7/20 ; F28F3/12 ; F28D15/02 ; F28D21/00 ; F28F9/02 ; H01L23/473

Abstract:
A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
Public/Granted literature
- US20150013939A1 COLD CHASSIS FOR ELECTRONIC MODULES AND METHOD OF MAKING SAME Public/Granted day:2015-01-15
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