A system for managing a data center including a plurality of electronic components, each of which are configured to generate varying levels of heat loads under varying power level utilizations, is disclosed. The system may comprise a data collection module adapted to collect data describing heat loads generated by the plurality of electronic components; an implementation module adapted to implement a model to predict a thermal topology of the data center, wherein the model is based on thermodynamic state equations; and a control module adapted to adjust the heat load of at least one of the plurality of electronic components based on the model.