Invention Grant
- Patent Title: Multilayer coil component
- Patent Title (中): 多层线圈组件
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Application No.: US14084264Application Date: 2013-11-19
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Publication No.: US09530554B2Publication Date: 2016-12-27
- Inventor: Soo Hwan Son , Jin Woo Hahn , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0131551 20121120
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01B1/02 ; H01F17/00 ; C04B35/26

Abstract:
Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.
Public/Granted literature
- US20140139309A1 MULTILAYER COIL COMPONENT Public/Granted day:2014-05-22
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