Invention Grant
- Patent Title: Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
- Patent Title (中): 制造具有保护层的半导体器件代替低电阻手柄层的印刷电路模块的方法
-
Application No.: US14885243Application Date: 2015-10-16
-
Publication No.: US09530709B2Publication Date: 2016-12-27
- Inventor: Dirk Robert Walter Leipold , George Maxim , Julio C. Costa , Baker Scott
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow + Terranova, P.L.L.C.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/306 ; H01L21/304 ; H01L21/02 ; H01L21/683 ; H01L23/29 ; H01L23/373 ; H01L23/00 ; H05K1/02 ; H05K1/18 ; H01Q1/50
Abstract:
A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and at least one deep well within the at least one device layer. A protective layer is disposed over the at least one deep well, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Public/Granted literature
Information query
IPC分类:
