Invention Grant
- Patent Title: Bonding LED die to lead frame strips
- Patent Title (中): 将LED模具接合到引线框条
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Application No.: US14901705Application Date: 2014-06-18
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Publication No.: US09530949B2Publication Date: 2016-12-27
- Inventor: Sze Kuang Lee , Paul Scott Martin , Albrecht Johannes Kraus , Chunheng Kang , Hui Ling Pan , Long Yin
- Applicant: KONINKLIJKE PHILIPS N.V.
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Agency: Patent Law Group LLP
- Agent Brian D. Ogonowsky
- International Application: PCT/IB2014/062347 WO 20140618
- International Announcement: WO2014/207620 WO 20141231
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L25/075 ; H01L33/56

Abstract:
In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
Public/Granted literature
- US20160329473A1 Bonding LED Die to Lead Frame Strips Public/Granted day:2016-11-10
Information query
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