Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
- Patent Title (中): 具有电路的悬挂板及其制造方法
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Application No.: US14519636Application Date: 2014-10-21
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Publication No.: US09532445B2Publication Date: 2016-12-27
- Inventor: Hiroyuki Tanabe
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2013-269912 20131226
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; G11B5/48 ; G11B21/16 ; H05K1/02 ; H05K1/05 ; H05K3/44
Abstract:
A suspension board with circuit includes a metal supporting layer and an insulating layer formed on the metal supporting layer. The insulating layer is made of a single layer, a concave portion is formed in the insulating layer, an opening portion that exposes the metal supporting layer is formed in the concave portion, and an electrically conductive metal portion is formed in the opening portion.
Public/Granted literature
- US20150189742A1 SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF Public/Granted day:2015-07-02
Information query
