Invention Grant
- Patent Title: Ultrasonic probe apparatus and method of manufacturing ultrasonic probe apparatus
- Patent Title (中): 超声波探头装置及其制造方法
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Application No.: US13870285Application Date: 2013-04-25
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Publication No.: US09532767B2Publication Date: 2017-01-03
- Inventor: Kyung Il Cho , Dong Wook Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0043354 20120425
- Main IPC: A61B8/14
- IPC: A61B8/14 ; A61B8/00 ; G01S15/89 ; B06B1/06
Abstract:
An ultrasonic probe apparatus and a method of manufacturing the ultrasonic probe apparatus are provided. The ultrasonic probe apparatus may include at least one first tile which transmits an ultrasonic beam toward a target object, and at least one second tile which receives an ultrasonic beam which is reflected from the target object.
Public/Granted literature
- US20130289410A1 ULTRASONIC PROBE APPARATUS AND METHOD OF MANUFACTURING ULTRASONIC PROBE APPARATUS Public/Granted day:2013-10-31
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