Invention Grant
- Patent Title: Method of eliminating sub-surface porosity
- Patent Title (中): 消除次表面孔隙度的方法
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Application No.: US14888670Application Date: 2014-05-02
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Publication No.: US09533372B2Publication Date: 2017-01-03
- Inventor: Christopher F. O'Neill
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- International Application: PCT/US2014/036563 WO 20140502
- International Announcement: WO2014/179679 WO 20141106
- Main IPC: B22F3/00
- IPC: B22F3/00 ; B23K26/06 ; B29C67/00 ; B22F3/105 ; B33Y10/00 ; B29K105/00

Abstract:
A method for operating an additive manufacturing apparatus, the method comprises directing a first energy beam along a surface contour vector in a build plane. A second energy beam is directed along a plurality of substantially parallel hatch vectors disposed in the build plane inward of the surface contour vector. A sum of the surface contour vector and the plurality of hatch vectors define a processed powder region in the build plane. A third energy beam is directed along an offset contour vector in the build plane. The offset contour vector includes a plurality of unprocessed powder regions in the build plane between the surface contour vector and the plurality of hatch vectors.
Public/Granted literature
- US20160052087A1 METHOD OF ELIMINATING SUB-SURFACE POROSITY Public/Granted day:2016-02-25
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