Invention Grant
- Patent Title: Wavelength-selectable coating thickness measurement apparatus
- Patent Title (中): 波长可选涂层厚度测量装置
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Application No.: US14505747Application Date: 2014-10-03
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Publication No.: US09534889B2Publication Date: 2017-01-03
- Inventor: Jeong Eun Kim , Hyun Seo Kang , Hyoung Jun Park , Young Soon Heo , Keo Sik Kim , Eun Kyoung Jeon , Kwon Seob Lim , Young Sun Kim
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2013-0152913 20131210
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01B17/02

Abstract:
Provided is an apparatus that measures a thickness of a coating by selecting a wavelength of a laser based on a color of the coating using a contactless method using a photoacoustic effect and an interferometer, the apparatus including a pulsed laser source to irradiate a pulsed laser beam toward the coating, a continuous wave (CW) laser source to irradiate a CW laser beam toward the coating, a detector to detect an optical interference signal corresponding to the CW laser beam, and a signal processor to process the optical interference signal to calculate a thickness of the coating.
Public/Granted literature
- US20150159997A1 WAVELENGTH-SELECTABLE COATING THICKNESS MEASUREMENT APPARATUS Public/Granted day:2015-06-11
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