Invention Grant
US09536714B2 Sputtering target having increased power compatibility 有权
溅射目标具有增加的功率兼容性

Sputtering target having increased power compatibility
Abstract:
A plate-centering system that has a plate with a holder, in which the plate is centered in the holder both at room temperature and at higher temperatures, independently of the thermal expansion of the plate and the holder, and the plate can freely expand in the holder at higher temperatures. The invention relates in particular to a target having a frame-shaped target mount, which is very well suited for use in a coating source for high power pulsed magnetron sputtering of the target.
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