Invention Grant
- Patent Title: Sputtering target having increased power compatibility
- Patent Title (中): 溅射目标具有增加的功率兼容性
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Application No.: US14783168Application Date: 2014-04-07
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Publication No.: US09536714B2Publication Date: 2017-01-03
- Inventor: Siegfried Krassnitzer , Juerg Hagmann , Joerg Kerschbaumer
- Applicant: Oerlikon Surface Solutions AG, Trübbach
- Applicant Address: CH Pfäffikon
- Assignee: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
- Current Assignee: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
- Current Assignee Address: CH Pfäffikon
- International Application: PCT/EP2014/000927 WO 20140407
- International Announcement: WO2014/166620 WO 20141016
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34

Abstract:
A plate-centering system that has a plate with a holder, in which the plate is centered in the holder both at room temperature and at higher temperatures, independently of the thermal expansion of the plate and the holder, and the plate can freely expand in the holder at higher temperatures. The invention relates in particular to a target having a frame-shaped target mount, which is very well suited for use in a coating source for high power pulsed magnetron sputtering of the target.
Public/Granted literature
- US20160064201A1 SPUTTERING TARGET HAVING INCREASED POWER COMPATIBILITY Public/Granted day:2016-03-03
Information query
IPC分类: