Invention Grant
- Patent Title: 3D flex soldering
- Patent Title (中): 3D柔性焊接
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Application No.: US14574191Application Date: 2014-12-17
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Publication No.: US09538662B2Publication Date: 2017-01-03
- Inventor: Richard A. Besen , Eric W. Bates , Gregory N. Stephens
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H05K1/18 ; H01R12/00 ; H05K3/34

Abstract:
In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.
Public/Granted literature
- US20160095204A1 3D FLEX SOLDERING Public/Granted day:2016-03-31
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