Invention Grant
- Patent Title: Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer
- Patent Title (中): 布线基板，布线基板的制造方法以及绝缘层的表面改性方法
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Application No.: US14627099Application Date: 2015-02-20
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Publication No.: US09538668B2Publication Date: 2017-01-03
- Inventor: Hideki Yumoto , Yoichi Harayama
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2014-040864 20140303; JP2014-105652 20140521
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H05K3/34 ; H01L23/498 ; H01L21/48
Abstract:
A wiring substrate includes an insulating layer and a pad exposed from the insulating layer. An outermost surface of the insulating layer is modified to have a hydrophobic property by being stamped with silicone.
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