Disclosed herein, amongst other things is a component (100, 200, 300, 400, 500, 600, 700, 800, 900, 1000) of a molding system (402) (e.g. mold component, post-mold component, etc.) having a heat dissipater (130, 230, 330, 430, 530, 630, 730, 830, 930, 1030) that is configured to impart a profiled heat removal rate on a selected portion of a molded article (120, 220, 320, 420) that generally matches a heat distribution therein.