Invention Grant
US09541578B2 Capacitive sensor sheet producing method and capacitive sensor sheet
有权
电容传感器片材生产方法和电容式传感器片材
- Patent Title: Capacitive sensor sheet producing method and capacitive sensor sheet
- Patent Title (中): 电容传感器片材生产方法和电容式传感器片材
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Application No.: US14112176Application Date: 2012-04-20
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Publication No.: US09541578B2Publication Date: 2017-01-10
- Inventor: Satoshi Shimada , Hiroto Komatsu
- Applicant: Satoshi Shimada , Hiroto Komatsu
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2011-096985 20110425; JP2012-093534 20120417
- International Application: PCT/JP2012/060748 WO 20120420
- International Announcement: WO2012/147659 WO 20121101
- Main IPC: G01R27/26
- IPC: G01R27/26 ; G01R3/00 ; G06F3/044

Abstract:
A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.
Public/Granted literature
- US20140035599A1 CAPACITIVE SENSOR SHEET PRODUCING METHOD AND CAPACITIVE SENSOR SHEET Public/Granted day:2014-02-06
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