Invention Grant
- Patent Title: Interconnect array pattern with a 3:1 signal-to-ground ratio
- Patent Title (中): 具有3:1信号对地比的互连阵列模式
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Application No.: US14551185Application Date: 2014-11-24
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Publication No.: US09543241B2Publication Date: 2017-01-10
- Inventor: Zhaoqing Chen , Matteo Cocchini , Rohan U. Mandrekar , Tingdong Zhou
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/528 ; H04B3/32 ; H01P3/02 ; H01P3/08 ; H05K1/02 ; H04B1/00

Abstract:
An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.
Public/Granted literature
- US20160150638A1 INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO Public/Granted day:2016-05-26
Information query
IPC分类: