发明授权
- 专利标题： Surface-mount electronic component
- 专利标题（中）： 表面贴装电子元件
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申请号： US15051158申请日： 2016-02-23
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公开(公告)号： US09543247B1公开(公告)日： 2017-01-10
- 发明人: Olivier Ory
- 申请人： STMicroelectronics (Tours) SAS
- 申请人地址： FR Tours
- 专利权人： STMicroelectronics (Tours) SAS
- 当前专利权人： STMicroelectronics (Tours) SAS
- 当前专利权人地址： FR Tours
- 代理机构： Gardere Wynne Sewell, LLP
- 优先权： FR1558067 20150831
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L29/06 ; H01L29/16 ; H01L23/528 ; H01L21/306 ; H01L21/304 ; H01L21/302 ; H01L21/768 ; H01L21/78
摘要：
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
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