Invention Grant
- Patent Title: Chamfered corner crackstop for an integrated circuit chip
- Patent Title (中): 用于集成电路芯片的倒角角裂缝
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Application No.: US14711109Application Date: 2015-05-13
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Publication No.: US09543254B2Publication Date: 2017-01-10
- Inventor: Mark C. Lamorey , David B. Stone
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent David A. Cain, Esq.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/58 ; H01L21/768

Abstract:
A corner crackstop is formed in each of the four corners of an integrated circuit (IC) chip, in which the corner crackstop differs structurally from a portion of the crackstop disposed along the sides of the IC chip. Each corner crackstop includes a plurality of layers, formed on a top surface of a silicon layer of the IC chip, within a perimeter boundary region that comprises a triangular area, in which a right angle is disposed on a bisector of the corner, equilateral sides of the triangle are parallel to sides of the IC chip, and the right angle is proximate to the corner relative to a hypotenuse of the triangle. The plurality of layers of the corner crackstop include crackstop elements, each comprising a metal cap centered over a via bar, in which the plurality of layers of the corner crackstop is chamfered to deflect crack ingress forces by each corner crackstop.
Public/Granted literature
- US20150255405A1 CHAMFERED CORNER CRACKSTOP FOR AN INTEGRATED CIRCUIT CHIP Public/Granted day:2015-09-10
Information query
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