Invention Grant
- Patent Title: Reduced-warpage laminate structure
- Patent Title (中): 减薄翘曲层压结构
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Application No.: US15043631Application Date: 2016-02-15
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Publication No.: US09543255B2Publication Date: 2017-01-10
- Inventor: Mark C. Lamorey , Shidong Li , Janak G. Patel , Douglas O. Powell , David J. Russell , Peter Slota, Jr. , David B. Stone
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H05K1/02
Abstract:
A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.
Public/Granted literature
- US20160157357A1 REDUCED-WARPAGE LAMINATE STRUCTURE Public/Granted day:2016-06-02
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