Invention Grant
- Patent Title: Joint material, and jointed body
- Patent Title (中): 接头材料和接头体
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Application No.: US14178847Application Date: 2014-02-12
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Publication No.: US09543265B2Publication Date: 2017-01-10
- Inventor: Motomune Kodama , Takashi Naito , Tadashi Fujieda , Yuichi Sawai , Takuya Aoyagi , Masanori Miyagi
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2013-061762 20130325
- Main IPC: H01F3/00
- IPC: H01F3/00 ; H01L23/00 ; C04B35/645 ; C04B37/02

Abstract:
Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.
Public/Granted literature
- US20140287227A1 Joint Material, and Jointed Body Public/Granted day:2014-09-25
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