The present invention provides a method for manufacturing an array substrate comprising: sequentially forming an adhesion enhancement layer, a copper-bearing metal layer and a photoresist layer on a substrate, and respectively forming a reserved region and a removal region by performing exposure and development on the photoresist layer using a mask plate, simultaneously processing the adhesion enhancement layer, the copper-bearing metal layer and the photoresist layer in the removal region by a single wet etching process, to form an adhesion enhancement intermediate layer corresponding to the adhesion enhancement layer, a copper-bearing metal intermediate layer corresponding to the copper-bearing metal layer and the photoresist layer thereon in the reserved region; simultaneously processing the adhesion enhancement intermediate layer, the copper-bearing metal intermediate layer and the photoresist layer by a dry etching process, then stripping off the photoresist layer, to form a patterned adhesion enhancement layer and a patterned copper-bearing metal layer respectively.