发明授权
- 专利标题： Multi-directional trenching of a die in manufacturing superjunction devices
- 专利标题（中）： 在制造超结装置中的模具的多方向开槽
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申请号： US13169378申请日： 2011-06-27
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公开(公告)号： US09543380B2公开(公告)日： 2017-01-10
- 发明人: Takeshi Ishiguro , Kenji Sugiura , Hugh J. Griffin
- 申请人： Takeshi Ishiguro , Kenji Sugiura , Hugh J. Griffin
- 申请人地址： US TX Dallas
- 专利权人： Michael W. Shore
- 当前专利权人： Michael W. Shore
- 当前专利权人地址： US TX Dallas
- 代理机构： Panitch Schwarze Belisario & Nadel LLP
- 主分类号： H01L29/02
- IPC分类号： H01L29/02 ; H01L29/06
摘要：
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is different from the first orientation is formed in the at least one die.
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