Invention Grant
- Patent Title: Semiconductor light emitting device and method for manufacturing same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US15065146Application Date: 2016-03-09
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Publication No.: US09543484B1Publication Date: 2017-01-10
- Inventor: Mitsuyoshi Endo , Shuji Itonaga , Miyuki Shimojuku , Yukihiro Nomura , Hideto Furuyama
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-179421 20150911
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; H01L33/46 ; H01L33/02 ; H01L33/62 ; H01L33/50

Abstract:
According to one embodiment, a semiconductor light-emitting device includes a semiconductor layer including a first semiconductor layer, a second semiconductor layer, a light emitting layer, a first surface, and a second surface, the light emitting layer provided between the first semiconductor layer and the second semiconductor layer, the second surface opposing the first surface; a p-side electrode; an n-side electrode; a p-side pillar; an n-side pillar; a first insulating layer; an optical layer; a second insulating layer; a first layer; a p-side interconnect; and an n-side interconnect. The first layer includes a first lower end portion and a second lower end portion.
Information query
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