发明授权
- 专利标题: Folded corrugated substrate integrated waveguide
- 专利标题(中): 折叠瓦楞纸板集成波导
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申请号: US14649089申请日: 2013-11-29
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公开(公告)号: US09543628B2公开(公告)日: 2017-01-10
- 发明人: Hai Young Lee , Dae Keun Cho , Jin do Byun
- 申请人: AJOU UNIVERSITY INDUSTRY COOPERATION FOUNDATION
- 申请人地址: KR Suwon-si
- 专利权人: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
- 当前专利权人: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
- 当前专利权人地址: KR Suwon-si
- 代理机构: Stein IP, LLC
- 优先权: KR10-2013-0031457 20130325
- 国际申请: PCT/KR2013/010972 WO 20131129
- 国际公布: WO2014/157809 WO 20141002
- 主分类号: H01P3/12
- IPC分类号: H01P3/12 ; H01P3/16 ; H01P3/123
摘要:
A folded corrugated substrate integrated waveguide is disclosed. The folded corrugated substrate integrated waveguide, according to one embodiment of the present invention, comprises: a first conductor plate having upper surface stubs respectively formed on both sides thereof in the lengthwise direction; a first dielectric substrate of which the upper surface is attached to the lower surface of the first conductor plate; a second conductor plate of which the upper surface is attached to the lower surface of the first dielectric substrate; a second dielectric substrate of which the upper surface is attached to the lower surface of the second conductor plate; and two stub conductor arrays spaced at a certain distance so as to be arranged in parallel to each other and attached to the lower surface of the second dielectric substrate, wherein each of the stub conductors in the two stub conductor arrays is electrically connected to a position corresponding to the upper surface stub of the first conductor plate through a via-hole which vertically penetrates the first dielectric substrate, the second conductor plate, and the second dielectric substrate.
公开/授权文献
- US20150318598A1 FOLDED COURRUGATED SUBSTRATE INTEGRATED WAVEGUIDE 公开/授权日:2015-11-05
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