An integrated circuit package includes an interposer with an embedded clock network formed by multiple clock trees. A die with first and second clock circuits is disposed over the interposer. At least one of the first and second clock trees is a resonant clock tree and both the first and second clock circuits may provide clock signals at different frequencies. The first clock circuit may provide clock signals at one frequency to a clock tree in the embedded clock network while the second clock circuit may provide clock signals at another frequency to another clock tree in the embedded clock tree network.