Invention Grant
- Patent Title: Switching architecture with packet encapsulation
- Patent Title (中): 具有封包封装的交换架构
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Application No.: US14310743Application Date: 2014-06-20
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Publication No.: US09544080B2Publication Date: 2017-01-10
- Inventor: Daniel W. English , John Doucette , Paul Miller , Hicham Saab
- Applicant: GENBAND US LLC
- Applicant Address: US TX Plano
- Assignee: Genband US LLC
- Current Assignee: Genband US LLC
- Current Assignee Address: US TX Plano
- Agency: Haynes and Boone, LLP
- Main IPC: H04L12/66
- IPC: H04L12/66 ; H04J3/16 ; H04L12/64 ; H04M7/00 ; H04M7/12

Abstract:
The invention includes, among other things, a system for passing TDM traffic through a packet switch. In one embodiment, the system includes a packet switch that has a plurality of data ports and is capable of routing FSDU packets between the plurality of data ports. A TDM encapsulation circuit process a TDM data flow that is incoming to the switch. A circuit demultiplexer processes the incoming data flow to buffer data associated with different TDM circuits into different buffer locations. A timer monitors the amount of time available to fill the FSDU, and when the time period reaches the frame boundary, an FSDU generator generates an FSDU that is filled with data associated with the TDM circuits. Header information is added for allowing the packet switch to route the generated FSDU to a port associated with the respective TDM circuit.
Public/Granted literature
- US20140301398A1 SWITCHING ARCHITECTURE WITH PACKET ENCAPSULATION Public/Granted day:2014-10-09
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