Invention Grant
- Patent Title: Memory device having only the top poly cut
- Patent Title (中): 仅具有顶部多边形切割的存储器件
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Application No.: US14742944Application Date: 2015-06-18
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Publication No.: US09548121B2Publication Date: 2017-01-17
- Inventor: Chih-Wei Lee , Shaw-Hung Ku , Cheng-Hsien Cheng
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Alston & Bird LLP
- Main IPC: G11C16/08
- IPC: G11C16/08 ; G11C16/04 ; H01L27/115 ; H01L21/768

Abstract:
Methods and apparatuses are contemplated herein for enhancing the efficiency of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a substrate and 3D array of nonvolatile memory cells, the 3D array including a plurality of conductive layers, separated from each other by insulating layers, the plurality of conductive layers comprising a top layer, the top layer comprising n string select lines (SSLs) and one or more bottom layers, the top layer further comprises n−1 cuts, each cut electrically separating two SSLs, wherein each cut is cut to a depth of the top layer and not extending into the bottom layers and a plurality of vertical channels arranged orthogonal to the plurality of layers, each of the plurality of channels comprising a string of memory cells, each of plurality of strings coupled to a bit line, an SSL and one or more word lines.
Public/Granted literature
- US20160372198A1 MEMORY DEVICE HAVING ONLY THE TOP POLY CUT Public/Granted day:2016-12-22
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