Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US14932122Application Date: 2015-11-04
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Publication No.: US09548271B2Publication Date: 2017-01-17
- Inventor: Kuei-Ti Chan , Tzu-Hung Lin , Ching-Liou Huang
- Applicant: MediaTek Inc
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/528 ; H01L23/522 ; H01L23/00 ; H01Q23/00 ; H01L23/31 ; H01L23/64 ; H01L23/66 ; H01L23/525

Abstract:
A semiconductor package includes a substrate, a first passivation layer disposed on the substrate, and an under bump metallurgy layer disposed on the first passivation layer. An additional under bump metallurgy layer is disposed on the first passivation layer, isolated from the under bump metallurgy layer; and a conductive pillar disposed on the additional under bump metallurgy layer.
Public/Granted literature
- US20160056105A1 SEMICONDUCTOR PACKAGE Public/Granted day:2016-02-25
Information query
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