Invention Grant
- Patent Title: Method of forming a thin film and an electronic device
- Patent Title (中): 薄膜和电子器件的形成方法
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Application No.: US13922436Application Date: 2013-06-20
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Publication No.: US09548466B2Publication Date: 2017-01-17
- Inventor: In Sun Park , Yeong Suk Choi , Jung Kyu Kim , Jong Hyeok Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Research & Business Foundation of Sungkyunkwan University Sungkyunkwan University
- Current Assignee: Samsung Electronics Co., Ltd.,Research & Business Foundation of Sungkyunkwan University Sungkyunkwan University
- Current Assignee Address: KR Gyeonggi-do KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0151135 20121221
- Main IPC: H01L51/44
- IPC: H01L51/44 ; H01L51/00 ; B82Y10/00 ; H01L51/42
Abstract:
A method of forming a thin film includes coating one side of a transferring stamp including a hydrophilic polymer layer with a hydrophilic solution to form a transfer layer, and transferring the transfer layer to the substrate.
Public/Granted literature
- US20140179052A1 METHOD OF FORMING A THIN FILM AND AN ELECTRONIC DEVICE Public/Granted day:2014-06-26
Information query
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