Invention Grant
- Patent Title: Systems and methods for electrically connecting circuit devices for power distribution enclosures
- Patent Title (中): 用于电连接配电箱的电路设备的系统和方法
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Application No.: US14719243Application Date: 2015-05-21
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Publication No.: US09548546B2Publication Date: 2017-01-17
- Inventor: Steven Pever , Timothy J. Fink , Karthik Chandran Krishnamurthy , Raymond Jadin
- Applicant: Siemens Industry, Inc.
- Applicant Address: US GA Alpharetta
- Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee Address: US GA Alpharetta
- Main IPC: H01H71/08
- IPC: H01H71/08 ; H01R4/34 ; H01R4/56

Abstract:
A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.
Public/Granted literature
- US20150255887A1 SYSTEMS AND METHODS FOR ELECTRICALLY CONNECTING CIRCUIT DEVICES FOR POWER DISTRIBUTION ENCLOSURES Public/Granted day:2015-09-10
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