Invention Grant
US09549050B2 Housing, processing method thereof, and electronic device using the same
有权
壳体及其加工方法以及使用其的电子设备
- Patent Title: Housing, processing method thereof, and electronic device using the same
- Patent Title (中): 壳体及其加工方法以及使用其的电子设备
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Application No.: US14154496Application Date: 2014-01-14
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Publication No.: US09549050B2Publication Date: 2017-01-17
- Inventor: Jong-Chul Choi , Hee-Cheul Moon , Ik-Su Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongton-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongton-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC.
- Priority: KR10-2013-0014674 20130208
- Main IPC: H04M1/02
- IPC: H04M1/02 ; B29C45/14 ; B29C45/00 ; B29L31/34
Abstract:
An electronic device is provided including a plurality of electronic parts; one or more housing components forming a space for receiving the plurality of electronic parts; and a cover detachable from the one or more housing components, the cover including a first member having a plurality of metal elements suspended in a non-metal base and a second member coupled to the first member.
Public/Granted literature
- US20140228080A1 HOUSING, PROCESSING METHOD THEREOF, AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2014-08-14
Information query
