Invention Grant
- Patent Title: Ring radiator compression driver features
- Patent Title (中): 环形散热器压缩驱动功能
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Application No.: US14297829Application Date: 2014-06-06
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Publication No.: US09549237B2Publication Date: 2017-01-17
- Inventor: Allan Devantier , Colby J. Buddelmeyer
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Steven Laut
- Main IPC: H04R1/20
- IPC: H04R1/20 ; H04R1/02 ; H04R25/00
Abstract:
A speaker includes an enclosure including a peripheral sound wave exit. A compression driver is connected to the speaker enclosure. Sound waves are peripherally spread from the sound wave exit of the speaker enclosure.
Public/Granted literature
- US20150319515A1 RING RADIATOR COMPRESSION DRIVER FEATURES Public/Granted day:2015-11-05
Information query
