Invention Grant
- Patent Title: Inter-eNode B handover procedure
- Patent Title (中): eNode-B间切换过程
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Application No.: US14316720Application Date: 2014-06-26
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Publication No.: US09549346B2Publication Date: 2017-01-17
- Inventor: Masato Kitazoe
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04W36/00 ; H04W12/02 ; H04W92/20

Abstract:
Methodologies are described that facilitate inter-eNode B handover. In various embodiments, logical protocol termination can be implemented between the user equipment and the target eNode B for inter-eNode B handover signaling. The provided handover forwarding and encapsulation mechanisms enable improved inter-operability between eNode Bs implementing different protocol versions or from different vendors, which in turn enables frequent protocol upgrades. Additionally, the invention enables the target eNode B to implement new radio configurations even if the configuration is unsupported by the source eNode B.
Public/Granted literature
- US20140307711A1 INTER-ENODE B HANDOVER PROCEDURE Public/Granted day:2014-10-16
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