Invention Grant
- Patent Title: Transceiver module adapter device
- Patent Title (中): 收发器模块适配器设备
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Application No.: US14471047Application Date: 2014-08-28
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Publication No.: US09549470B2Publication Date: 2017-01-17
- Inventor: Michel Blier , Patrick Begin , Sergio Prestipino
- Applicant: EXFO Inc.
- Applicant Address: CA Quebec
- Assignee: EXFO Inc.
- Current Assignee: EXFO Inc.
- Current Assignee Address: CA Quebec
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; G02B6/00 ; H05K1/02

Abstract:
There is provided an adapter device for connecting and interfacing a transceiver module in conformance with first mechanical specifications and first connector specifications into a host socket adapted to receive transceiver modules in conformance with second mechanical specifications and second connector specifications. The adapter device comprises: a rigid-flex circuit board having first and second levels of rigid circuit board portions and a flexible circuit board portion interconnecting the two levels to convey high-speed electrical signals therebetween, the two levels being integral with said flexible circuit board portion; a first connector mounted on the first level of rigid circuit board and in conformance with the first connector specifications, for electrically connecting the transceiver module to the adapter device to convey high-speed signals; and a second connector mounted on the second level of rigid circuit board and in conformance with the second connector specifications, for electrically connecting the adapter device into the host socket to convey high-speed signals.
Public/Granted literature
- US20150092363A1 TRANSCEIVER MODULE ADAPTER DEVICE Public/Granted day:2015-04-02
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