中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US09551081B2 Leveling composition and method for electrodeposition of metals in microelectronics 有权
微电子学中电沉积金属的调平组成和方法

  • Patent Title: Leveling composition and method for electrodeposition of metals in microelectronics
  • Patent Title (中): 微电子学中电沉积金属的调平组成和方法
  • Application No.: US13261924
    Application Date: 2014-05-05
  • Publication No.: US09551081B2
    Publication Date: 2017-01-24
  • Inventor: Yun Zhang , Tao Ma , Peipei Dong
  • Applicant: Yun Zhang , Tao Ma , Peipei Dong
  • Applicant Address: CN Wujiang, Jiangsu
  • Assignee: Shinhao Materials LLC
  • Current Assignee: Shinhao Materials LLC
  • Current Assignee Address: CN Wujiang, Jiangsu
  • Priority: CN201310731443 20131226; CN201310731859 20131226
  • International Application: PCT/CN2014/076807 WO 20140505
  • International Announcement: WO2015/096347 WO 20150702
  • Main IPC: C25D3/56
  • IPC: C25D3/56 ;  C25D3/58 ;  C25D3/38 ;  C07D311/84 ;  C07D311/82
Leveling composition and method for electrodeposition of metals in microelectronics
Abstract:
The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I):
Abstract(Chinese):

本公开内容涉及用于电沉积金属的流平组合物。 组合物包含式（I）的化合物：

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0