Invention Grant
- Patent Title: Housing components for electronic devices
- Patent Title (中): 电子设备的外壳部件
-
Application No.: US14317858Application Date: 2014-06-27
-
Publication No.: US09552022B2Publication Date: 2017-01-24
- Inventor: Todd F. Gotham , Andrew David Lauder , Tang Yew Tan , Erik L. Wang , Phillip Michael Hobson , Richard Hung Minh Dinh , Christopher Stringer , Richard Howarth , John Ternus , Rico Zorkendorfer
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K5/02
Abstract:
Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.
Public/Granted literature
- US20140307377A1 HOUSING COMPONENTS FOR ELECTRONIC DEVICES Public/Granted day:2014-10-16
Information query
