Invention Grant
- Patent Title: Headphone socket assembly and electronic equipment including same
- Patent Title (中): 耳机插座总成及电子设备包括相同
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Application No.: US14585297Application Date: 2014-12-30
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Publication No.: US09553382B2Publication Date: 2017-01-24
- Inventor: Wei Sun , Feng Guo , Zhenfei Lei
- Applicant: Xiaomi Inc.
- Applicant Address: CN Beijing
- Assignee: Xiaomi Inc.
- Current Assignee: Xiaomi Inc.
- Current Assignee Address: CN Beijing
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: CN201410302988 20140627
- Main IPC: H01R12/77
- IPC: H01R12/77 ; H01R24/58 ; H01R12/72 ; H01R13/6594
Abstract:
A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket.
Public/Granted literature
- US20150380847A1 HEADPHONE SOCKET ASSEMBLY AND ELECTRONIC EQUIPMENT INCLUDING SAME Public/Granted day:2015-12-31
Information query
