Invention Grant
- Patent Title: Implantable medical leads
- Patent Title (中): 可植入医疗用品
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Application No.: US14396239Application Date: 2013-02-14
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Publication No.: US09555234B2Publication Date: 2017-01-31
- Inventor: Victor Duijsens , Paulus C. van Venrooij
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A.
- International Application: PCT/US2013/026141 WO 20130214
- International Announcement: WO2014/018092 WO 20140130
- Main IPC: A61N1/08
- IPC: A61N1/08 ; A61N1/05 ; A61N1/36 ; H05K3/32

Abstract:
An assembly for a medical lead includes an elongated lead body, and a conductive element located at a distal portion of the lead body. The conductive element substantial!)′ encircles a longitudinal axis of the lead body. The assembly further includes a plurality of insulated conductors extending within the lead body, each of the insulated conductors being in electrical contact with the conductive element and extending to a proximal end of the lead body. Each of the insulated conductors contacts a different circumferential portion of the conductive element. The conductive element is configured to facilitate mechanical and electrical separation of different circumferential portions of the conductive element to form two or more electrode segments for the medical lead from the conductive element.
Public/Granted literature
- US20150142090A1 IMPLANTABLE MEDICAL LEADS Public/Granted day:2015-05-21
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