Invention Grant
- Patent Title: Molding, production method therefor, part for electronic devices and electronic device
- Patent Title (中): 成型及其制造方法,电子设备和电子设备部件
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Application No.: US13818050Application Date: 2011-07-27
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Publication No.: US09556513B2Publication Date: 2017-01-31
- Inventor: Wataru Iwaya , Takeshi Kondo
- Applicant: Wataru Iwaya , Takeshi Kondo
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-185633 20100820
- International Application: PCT/JP2011/067046 WO 20110727
- International Announcement: WO2012/023389 WO 20120223
- Main IPC: C23C14/48
- IPC: C23C14/48 ; B29C59/14 ; B05D7/04 ; B05D1/00 ; C08J7/04 ; C08J7/12

Abstract:
The invention is a formed article including a gas barrier layer, the gas barrier layer including a surface layer part that is formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, the surface layer part having a carbon atom content rate of more than 0 and not more than 70%, an oxygen atom content rate of 10 to 70%, a nitrogen atom content rate of 0 to 35%, and a silicon atom content rate of 20 to 55%, based on a total content rate of carbon atoms, oxygen atoms, nitrogen atoms, and silicon atoms; a method for producing the formed article; an electronic device member including the formed article; and an electronic device comprising the electronic device member. The formed article of the invention exhibits an excellent gas barrier capability, excellent transparency, and excellent bending resistance. The method for producing a formed article of the invention can efficiently, safely, and conveniently produce the formed article of the invention. The electronic device member of the invention may suitably be used for electronic devices such as displays and solar cells.
Public/Granted literature
- US20130202899A1 MOLDING, PRODUCTION METHOD THEREFOR, PART FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE Public/Granted day:2013-08-08
Information query
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